CSP Technology Roadmap

# Time Frame 2019 2020 2021
Production Sample
1 Line / Space (Semi-Additive) 20 / 20 15 / 20 14 / 18 12 / 16
2 Line / Space (Subtractive) 25 / 25 20 / 25 20 / 25 15 / 25
3 Through Via / Pad (Laser) 75 / 125 70 / 115 65 / 105 65 / 100
4 Through Via / Pad (Mechanical) 100 / 200 100 / 190
5 Micro Via / Pad (Laser) 65 / 100 60 / 90 50 / 80 50 / 80
6 FC Bump Pitch Peripheral Type (BOL) 40 / 80 30 / 60
7 Bond Finger Pitch (Finish W / S) 75(40 / 15) 70(40 / 15) 70(40 / 15) 65(40 / 12)
8 Solder Resist Registration (WB CSP) 25 20 20 15
9 Solder Resist Registration (FC CSP) 12.5 10 10 ~
10 Surface Finishing (WB CSP) NiAu.AFOP.NPL.Etch Back.ENEPIG NiAu.AFOP.NPL.Etch Back.ENEPIG
11 Surface Finishing (FC CSP) OSP / ENEPIG / Immersion Tin OSP / ENEPIG / Immersion Tin
12 Substrate Total Thickness (2 Layers) 100 80
13 Substrate Total Thickness (4 Layers) 170 140
14 Laminate Material CTE ~ 2 ppm CTE ~ 1 ppm CTE < 1 ppm
15 Solder Resist Material CTE ~ 30 ppm CTE ~ 20 ppm CTE < 10 ppm
* Ball placement available upon request
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